I would specify in the contract that the builder is required to follow and meet or exceed the NEC requirements for pools.
680.26 Equipotential Bonding
(B) Bonded Parts
The parts specified in 680.26(B)(1) through (B)(7) shall be bonded together using solid copper conductors, insulated covered, or bare, not smaller than 8 AWG or with rigid metal conduit of brass or other identified corrosion-resistant metal. Connections to bonded parts shall be made in accordance with 250.8. An 8 AWG or larger solid copper bonding conductor provided to reduce voltage gradients in the pool area shall not be required to be extended or attached to remote panelboards, service equipment, or electrodes.
(1) Conductive Pool Shells
Bonding to conductive pool shells shall be provided as specified in 680.26(B)(1)(a) or (B)(1)(b). Cast-in-place concrete, pneumatically applied or sprayed concrete, and concrete block with painted or plastered coatings shall all be considered conductive materials due to water permeability and porosity. Vinyl liners and fiberglass composite shells shall be considered to be nonconductive materials. Reconstructed pool shells shall also meet the requirements of this section.
(a)
Structural Reinforcing Steel. Unencapsulated structural reinforcing steel shall be bonded together by steel tie wires or the equivalent. Where structural reinforcing steel is encapsulated in a nonconductive compound, a copper conductor grid shall be installed in accordance with 680.26(B)(1)(b)
(b)
Copper Conductor Grid. A copper conductor grid shall be provided and shall comply with the following:
- Be constructed of minimum 8 AWG bare solid copper conductors bonded to each other at all points of crossing in accordance with 250.8 or other approved means
- Conform to the contour of the pool
- Be arranged in a 300 mm (12 in.) by 300 mm (12 in.) network of conductors in a uniformly spaced perpendicular grid pattern with a tolerance of 100 mm (4 in.)
- Be secured within or under the pool no more than 150 mm (6 in.) from the outer contour of the pool shell
(2) Perimeter Surfaces
The perimeter surface to be bonded shall be considered to extend for 1 m (3 ft) horizontally beyond the inside walls of the pool and shall include unpaved surfaces and other types of paving. Perimeter surfaces separated from the pool by a permanent wall or building 1.5 m (5 ft) in height or more shall require equipotential bonding only on the pool side of the permanent wall or building. Bonding to perimeter surfaces shall be provided as specified in 680.26(B)(2)(a), (B)(2)(b), or (B)(2)(c) and shall be attached to the pool reinforcing steel or copper conductor grid at a minimum of four points uniformly spaced around the perimeter of the pool. For nonconductive pool shells, bonding at four points shall not be required.
(a)
Structural Reinforcing Steel. Structural reinforcing steel shall be bonded in accordance with 680.26(B)(1)(a).
(b)
Copper Ring. Where structural reinforcing steel is not available or is encapsulated in a nonconductive compound, a copper conductor(s) shall be utilized where the following requirements are met:
- At least one minimum 8 AWG bare solid copper conductor shall be provided.
- The conductors shall follow the contour of the perimeter surface.
- Only listed splicing devices or exothermic welding shall be permitted.
- The required conductor shall be 450 mm to 600 mm (18 in. to 24 in.) from the inside walls of the pool.
- The required conductor shall be secured within or under the perimeter surface 100 mm to 150 mm (4 in. to 6 in.) below the subgrade.
(c)
Copper Grid. Where structural reinforcing steel is not available or is encapsulated in a nonconductive compound, copper grid shall be utilized where the following requirements are met:
- The copper grid shall be constructed of 8 AWG solid bare copper and be arranged in accordance with 680.26(B)(1)(b)(3).
- The copper grid shall follow the contour of the perimeter surface extending 1 m (3 ft) horizontally beyond the inside walls of the pool.
- Only listed splicing devices or exothermic welding shall be permitted.
- The copper grid shall be secured within or under the deck or unpaved surfaces between 100 mm to 150 mm (4 in. to 6 in.) below the subgrade.
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